Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 56134-9000 |
Series: | 56134 - MicroClasp - MUO 2.5 |
Connector Type: | MicroClasp, MUO 2.5 |
Gender: | Female |
Termination Method: | Crimp or Compression |
Contact Material: | Copper-Nickel-Silicon |
Contact Plating: | Tin |
Circuit Application: | Signal |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | .889 µm |
Contact Termination Plating Thickness: | .914 µm |
Wire Size: | 22 AWG, 24 AWG, 26 AWG, 28 AWG |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Wire Insulation Diameter: | .9 - 1.7 mm |
Part Aliases: | 0561349000 |
SKU: | MOL56134-9000 |
56134-9000
Heilind Number: | MOL56134-9000 |
Manufacturer: | Molex |
Manufacturer Number: | 56134-9000 |
Datasheet: | Product Specification |
ECAD Model: |
Specifications
Detailed Description
Elevate your connectivity with our MicroClasp - MUO 2.5 Female Connector, designed for seamless integration in a variety of applications. With versatile termination options including crimp or compression, this connector ensures secure and reliable contact. Crafted with Copper-Nickel-Silicon contacts plated with tin, it guarantees optimal conductivity. Suitable for wire sizes ranging from 22 AWG to 28 AWG, it accommodates diverse needs. RoHS compliant and featuring a durable construction, it meets stringent quality standards. Perfect for signal transmission, this connector is a vital component in any electronic setup. Trust in its performance for efficient and consistent connectivity.
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Product Change Notice
Effective Date | Description of Change | Download | |||
---|---|---|---|---|---|
09/15/2016 | 501416 - Equipment Transfer, Production Transfer or Rearrangement. | Download |