43650-0203

Heilind Number:MOL43650-0203
Manufacturer:Molex
Manufacturer Number:43650-0203
Datasheet:Packaging Specifications
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Single Row, 2 Circuits, with PCB Press-fit Metal Retention Clip, Tin, Glow-Wire Capable, Black

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 43650-0203
Color:Black
Series:43650
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:2
Number of Rows:1
Termination Method:Through Hole
Contact Material:Brass
Body Orientation:Right Angle
Pitch:3 mm
Voltage:600 V
Material:High Temperature Thermoplastic
Orientation:Right Angle
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:2.54 µm
Number of Contacts Loaded:2
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:2.540 µm
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:Yes
Mated Height:6.98 mm
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Material Flammability Standard:94V-0
Part Aliases:0436500203
SKU:MOL43650-0203

Detailed Description

Enhance your PCB connectivity with our Micro-Fit 3.0 Right Angle Header. Featuring a 3.00mm pitch, single row design with 2 circuits, this header is equipped with a PCB press-fit metal retention clip for secure installation. Its black housing, made of high-temperature thermoplastic, is glow wire capable and ensures durability in challenging environments. With a contact rating of 8.5A and voltage of 600V, it guarantees reliable performance. The right-angle orientation and through-hole termination method offer flexibility in assembly, while the tin plating on contact areas ensures optimal conductivity. RoHS compliant and lead-free process capable, this header is suitable for a range of applications, from SMC to wave soldering processes. Trust in the Micro-Fit 3.0 for efficient wire-to-board connections.