Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 56134-9000 |
Series: | 56134 - MicroClasp - MUO 2.5 |
Connector Type: | MicroClasp, MUO 2.5 |
Gender: | Female |
Termination Method: | Crimp or Compression |
Contact Material: | Copper-Nickel-Silicon |
Contact Plating: | Tin |
Circuit Application: | Signal |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | .889 µm |
Contact Termination Plating Thickness: | .914 µm |
Wire Size: | 22 AWG, 24 AWG, 26 AWG, 28 AWG |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Wire Insulation Diameter: | .9 - 1.7 mm |
Part Aliases: | 756054317761 56134-9000 0561349000 |
SKU: | MOL56134-9000.P |
56134-9000
Heilind Number: | MOL56134-9000.P |
Manufacturer: | Molex |
Manufacturer Number: | 56134-9000 |
Datasheet: | Product Specification |
ECAD Model: |
Specifications
Detailed Description
Enhance your connectivity with our 2.00mm Pitch Crimp Terminal, designed for seamless integration in MicroClasp and MUO 2.5 systems. Crafted for optimal performance, this Female terminal accommodates 22-28 AWG wire sizes, offering versatility for various applications. Constructed with durable Copper Alloy and featuring Tin plating, it ensures reliable signal transmission. Its efficient Crimp or Compression termination method guarantees secure connections, while its compact design suits Wire to Board setups. With RoHS compliance and a focus on quality, this terminal is a must-have for your electronic projects. Elevate your connections with ease and precision.
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