501331-0607

Heilind Number:MOL501331-0607
Manufacturer:Molex
Manufacturer Number:501331-0607
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

1.00mm Pitch Pico-Clasp Wire-to-Board Header, Surface Mount, Single Row, Vertical, Tin Plated, with Inner Positive Lock, with Pick-and-Place Tape, 6 Circuits

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 501331-0607
Color:Natural
Series:501331 - Pico-Clasp
Amperage:1 A
Connector Type:Pico-Clasp
Number of Contacts:6
Number of Rows:1
Termination Method:Surface Mount
Contact Material:Phosphor Bronze
Body Orientation:Straight
Pitch:1 mm
Voltage:50 V AC/DC
Material:Nylon
Orientation:Vertical
Pick and Place:Vacuum Pick-Up Tape
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Tin
Number of Contacts Loaded:6
Mating Cycles:30
PCB Locator:No
PCB Retention:Yes
Polarized to PCB:No
Polarized to Mate:Yes
Connector System:Wire to Board
Contact Termination Plating:Tin
Glow Wire Capable:No
Lock to Mating Part:Yes
Stackable:No
Breakaway:No
Part Aliases:5013310607
SKU:MOL501331-0607

Detailed Description

Enhance your PCB connections with our 501331 series Pico-Clasp connector. Featuring six contacts for seamless power and data transmission, this straight orientation connector is designed for surface mount installation with a 1mm pitch. Crafted with durable materials including phosphor bronze contacts and nylon body, it ensures reliable performance in a variety of applications. With a 1A amperage and 50V AC/DC voltage rating, it meets the demands of modern electronics. RoHS compliant and operating smoothly in temperatures ranging from -40 to 105°C, it's a dependable choice for your projects. The embossed tape packaging on reel, along with vacuum pick-up compatibility, streamlines assembly processes. Its tin plating and PCB retention feature guarantee secure connections, while its 30 mating cycles ensure long-term durability. Trust in the quality and efficiency of our Pico-Clasp connector for your wire-to-board applications.