| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 50394-8052 |
| Series: | 50394 - Milli-Grid |
| Amperage: | 1.5 A, 1 A, 2 A, .5 A |
| Connector Type: | Milli-Grid |
| Gender: | Female |
| Termination Method: | Crimp or Compression |
| Contact Material: | Copper Alloy |
| Contact Plating: | Nickel |
| Voltage: | 125 V |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Contact Termination Plating Thickness: | 2.032 µm |
| Wire Size: | 24 AWG, 26 AWG, 28 AWG, 30 AWG |
| Connector System: | Wire to Board, Wire to Wire |
| Contact Termination Plating: | Nickel |
| Wire Insulation Diameter: | 1.4 mm |
| Part Aliases: | 0503948052 |
| SKU: | MOL50394-8052 |
50394-8052
Specifications
Detailed Description
Enhance your connectivity with our Milli-Grid Crimp Terminal, designed for seamless integration in various applications. Crafted for efficiency, this female terminal offers reliable performance with its copper alloy construction and nickel plating. With a voltage rating of 125V and amperage options ranging from 0.5A to 2A, it ensures optimal power transmission. The gold-plated mating area guarantees low contact resistance, while the crimp or compression termination method allows for easy installation. Perfect for wire-to-wire or wire-to-board connections, this terminal accommodates 24-30 AWG wire sizes, making it versatile for diverse projects. Rest assured of its quality and compliance with RoHS standards, as it undergoes thorough testing. Elevate your connectivity solutions with this essential component.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | Molex 22-01-2027 | KK 254 Crimp Housing, Friction Ramp, 2 Circuits, Natural |  |
 | Molex 39-00-0041 | Mini-Fit Male Crimp Terminal, Tin (Sn) over Copper (Cu) Plated Brass Contact, 24-18 AWG | |
 | Molex 39-01-2045 | Mini-Fit Jr. Receptacle Housing, Dual Row, 4 Circuits, UL 94V-0, Natural | |
 | Molex 39-01-2086 | Mini-Fit Jr. Plug Housing, Dual Row, 8 Circuits, UL 94V-0, with Panel Mounting Ears, Natural | |
 | Molex 43025-0400 | Micro-Fit 3.0 Receptacle Housing, Dual Row, 4 Circuits, UL 94V-0, Low-Halogen, Black | |
 | Molex 43025-0600 | Micro-Fit 3.0 Receptacle Housing, Dual Row, 6 Circuits, UL 94V-0, Low-Halogen, Black | |
 | Molex 50-57-9402 | SL Crimp Housing, Single Row, Version G, Positive Latch, 2 Circuits, Black | |
 | Molex 50058-8000 | 1.25mm Pitch PicoBlade Crimp Terminal, Female, 28-32 AWG, Reel | |
 | Molex 505431-1000 | Cut Strip - Micro-Lock Plus Female Crimp Terminal, Tin (Sn) Plating, 26-30 AWG, Reel | |
 | Molex 51110-0460 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 4 Circuits, without Center Polarization Key, with Locking Ramp, Lead-Free | |
 | Molex 51110-0660 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 6 Circuits, without Center Polarization Key, with Locking Ramp, Lead-Free | |
 | Molex 51110-0856 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 8 Circuits, with Center Locking Ramp and Side Polarization Keys, Lead-Free | |
 | Molex 51110-1251 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 12 Circuits, with Center Polarization Key, without Locking Ramp, Lead-Free | |
 | Molex 51110-1260 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 12 Circuits, without Center Polarization Key, with Locking Ramp, Lead-Free | |
 | Molex 51110-1451 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 14 Circuits, with Center Polarization Key, with Locking Ramp, Lead-Free | |
 | Molex 51110-1651 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 16 Circuits, with Center Polarization Key, with Locking Ramp, Lead-Free | |
 | Molex 51110-2651 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 26 Circuits, with Center Polarization Key, with Locking Ramp, Lead-Free | |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 10/20/2020 | 508388 - Manufacturing Process Change. change process from Stamping (Blanking = Forming) -> plating to stamping (blanking)-> plating-> stamping (forming) for gold spotting process capability. the plating process change from dipping + brushing -> selective dipping + spotting. | Download | |||
Availability
Immediate Shipment:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 50394-8052 |
| Other Names: | 0503948052 |