Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 26-60-4120 |
Color: | Natural |
Series: | 41791 - KK 396 |
Amperage: | 7 A |
Connector Type: | KK 396 |
Number of Contacts: | 12 |
Number of Rows: | 1 |
Termination Method: | Through Hole |
Contact Material: | Brass |
Body Orientation: | Straight |
Pitch: | 3.96 mm |
Voltage: | 250 V |
Material: | Polyester |
Orientation: | Vertical |
Tail Length: | 3.56 mm |
Packaging: | Bag |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | 5.08 µm |
Number of Contacts Loaded: | 12 |
Mating Cycles: | 25 |
PCB Locator: | No |
PCB Retention: | Without |
Polarized to PCB: | No |
Contact Termination Plating Thickness: | 5.08 µm |
Polarized to Mate: | Yes |
PCB Thickness (Recommended): | 1.6 mm |
Connector System: | Wire to Board |
CSA Agency Certification: | LR19980 |
UL Agency Certification: | E29179 |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 235 °C |
Lead Free Process Capability: | WAVE |
Duration at Max. Process Temperature (seconds): | 005 |
Max. Cycles at Max. Process Temperature: | 001 |
Glow Wire Capable: | No |
Lock to Mating Part: | Yes |
Stackable: | Yes |
Breakaway: | No |
Shroud Type: | Partial |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0026604120 41791-0012 |
SKU: | MOL26-60-4120 |
26-60-4120
Specifications
Detailed Description
Easily connect wires to circuit boards with our KK 396 Header. Featuring a straight, vertical orientation and 12 circuits, this connector ensures secure and efficient PCB assembly. With a 3.96mm pitch and tin plating, it offers reliable conductivity at 250V and 7A. The friction lock design and polyester housing provide durability, while the brass contacts guarantee long-lasting performance. UL and CSA certified, it meets industry standards for safety and quality. Perfect for wire-to-board applications, this header is RoHS compliant, making it environmentally friendly. Upgrade your PCB connections with our KK 396 Header today.
Frequently Bought Together
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![]() | Molex 22-23-2061 | KK 254 Solid Header, Vertical, with Friction Lock, 6 Circuits, Tin (Sn) Plating | ![]() |
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![]() | Molex 39-30-0060 | Mini-Fit Jr. Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits, PA Polyamide Nylon 6/6 94V-0, 2.54µm Matte Tin (Sn) Plating | ![]() |
![]() | Molex 43045-0406 | Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Dual Row, 4 Circuits, with PCB Press-fit Metal Retention Clip, Tin, Glow-Wire Capable, Black | ![]() |
![]() | Molex 44441-2004 | 7.50mm Pitch Sabre Receptacle Crimp Housing, UL 94V-0, 4 Circuits, Black | ![]() |
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![]() | Molex 90131-0125 | 2.54mm Pitch C-Grid III Header, Dual Row, Vertical, 10 Circuits, Tin (Sn) Plating | ![]() |
Product Change Notice
Effective Date | Description of Change | Download | |||
---|---|---|---|---|---|
12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change | Download | |||
02/28/2022 | 511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts. | Download | |||
11/12/2021 | 510732 - Capacity change or tool replacement. new capacity mold and assembly machine is getting added. wafers will be supplied from any of 1 existing mold or 1 new mold after the implementation date. headers will be supplied from any 4 existing machines or 1 new machine after the implementation date. | Download | |||
03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download | |||
03/15/2019 | 506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. | Download | |||
07/01/2017 | 502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download |