| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 170382-0001 |
| Color: | Black |
| Series: | 170382 - zSFP Plus - zSFP |
| Amperage: | .5 A |
| Connector Type: | zSFP Plus |
| Gender: | Female |
| Number of Rows: | 2 |
| Termination Method: | Surface Mount |
| Contact Material: | Brass, Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | 8 mm |
| Voltage: | 30 V AC/DC |
| Material: | Thermoplastic |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | I/O Plug Connector Subassembly |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Ground to Panel / PCB: | No |
| Number of Contacts Loaded: | 20 |
| Mating Cycles: | 100 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | .381 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.57 mm |
| Supplier Product Group: | High Speed Cage & Connector Assemblies |
| Connector System: | Module to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 015 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Termination Pitch: | .8 mm |
| Electrical Model: | Yes |
| Lock to Mating Part: | No |
| Surface Mount Compatible: | Yes |
| Waterproof Dustproof: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 1703820001 |
| SKU: | MOL170382-0001 |
170382-0001
| Heilind Number: | MOL170382-0001 |
| Manufacturer: | Molex |
| Manufacturer Number: | 170382-0001 |
| Tariff Info (HTS): | 8536694040 |
This Line May Be Subject To CHN Tariff/Surcharge at 38.19% | |
| Datasheet: | Drawing |
| ECAD Model: | |
Description:
zSFP+ Assembly, Right-Angle, Surface Mount, 20 Circuits, 0.38?m Gold (Au), Tin Tails
More >>Specifications
Detailed Description
Elevate your high-speed connectivity with our zSFP+ Assembly, designed for optimal performance in demanding environments. This right-angle, surface-mount connector features 20 gold-plated circuits, ensuring reliable signal transmission. With a rugged black housing and female gender, it's perfect for industrial applications. The brass and phosphor bronze contacts are plated with gold for enhanced conductivity, while tin tails offer secure termination. Operating at up to 30V AC/DC and 0.5A, this connector is suitable for a wide range of power and data transmission needs. Its compact form factor, with a .8mm pitch and right-angle orientation, allows for efficient PCB integration. Certified to meet RoHS standards, it's also environmentally friendly. Whether you're designing networking equipment or high-speed devices, this zSFP+ Assembly guarantees top-notch performance and durability.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | Molex 170432-0002 | zQuad Small Form Factor Pluggable Plus (zQSFP+) Assembly, Surface Mount, 38 Circuits, Gold (Au) Plated 0.762?m, Supports QSFP28 / EDR |  |
 | Molex 171722-3002 | zQuad Small Form Factor Pluggable Plus (zQSFP+) Stacked Integrated 2-by-3, Connector and Cage with EMI Spring Finger, 228 Circuit, Gold (Au) Over Nickel Plated, Up/Down Light Pipe | |
 | Molex 171971-0105 | SL LCP VERT HDR ASSY TH 15AU 0 SL LCP VERT HD ASSY | |
 | Molex 204318-0006 | Sentrality 6.00mm Top-entry, Surface Mount Socket Assembly | |
 | Molex 44432-0802 | Micro-Fit BMI Header, Dual Row, Vertical, with PCB Polarizing Peg, 8 Circuits, 0.38µm Gold (Au) Selective Plating, Kinked Tails | |
 | Molex 503763-0291 | 1.00mm Pitch Pico-Lock Surface Mount Header, Right Angle, 1.50mm Height, Positive Side Locks, 2 Circuits | |
 | Molex 53047-0310 | 1.25mm Pitch PicoBlade Wire-to-Board Header, Vertical, with Friction Lock, 3 Circuits | |
 | Molex 53398-0471 | 1.25mm Pitch PicoBlade Header, Surface Mount, Vertical, 4 Circuits | |
 | Molex 78347-1004 | Impact 3 Pair, Right Angle Power Header, Left Hold-Down, Press-Fit, Module 1: P1 & P2 Blade Length 5.70mm & 6.90mm, LCP, Glass Filled UL94-V0, Black, Tray Packaging, Lead-Free | |
 | Molex 78798-0001 | 1.27mm Signal Pitch, 0.80mm Signal Pitch, 1.27mm Power Pitch U.2 (SFF-8639) Receptacle, Right Angle, Surface Mount, with Forklock, 2.85mm Height, 3.50mm Peg Length, 1.60mm PCB Thickness, 68 Circuits, with Cap, Embossed Tape and Reel, Lead-Free | |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 12/30/2023 | 513862 - Packaging Method/Quantity Changing. In order to internal process improve & improve quality, change the SPQ/box is from 960pcs to 1920pcs. | Download | |||
| 11/27/2022 | 512025 - Change To Product. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change is only the raw material supplier and will not affect fit, form or function. Molex has identified a shortage risk of resin supply which would create a challenge to fulfill orders therefore a new LCP resin has been identified for relative product. | Download | |||
| 07/01/2020 | 508674 - Capacity change or tool replacement. Molex Chengdu will be adding the ZSFP PLASTIC HOUSING 20KT capacity mold to support increasing demand. | Download | |||
| 02/17/2020 | 508159 - Production Location Change. Molex Chengdu will add local qualified vendor as stamping source, then will ve able to run terminal production in both locations of Molex Chengdu & local qualified stamping vendor. No impact to fit, form or function. | Download | |||
| 07/04/2019 | 506624 - Capacity change or tool replacement. another set of tooling is being added to meet the current and future demands of this product. | Download | |||
| 05/26/2019 | 505745 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Download | |||
| 12/16/2018 | 506163 - Manufacturing Process Change. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change. | Download | |||
| 07/26/2018 | 502820 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice are being moved to a different production or shipping location. No changes will be made to the product as a result of this move. | Download | |||
| 04/30/2015 | GCM 10657723 - Product Component Change. | Download | |||
| 08/03/2014 | GCM 10640994 - New, Modified, Or Replacement Tooling. The purpose of the change is new stamping die build from 1rowx1up to 2rowx1up and the reason of change is for supporting customer increasing monthly demand and mitigate constraint of press machine. No form, fit, function impacted on products. | Download | |||
Availability
Immediate Shipment:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
100
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 170382-0001 |
| Other Names: | 1703820001 |